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US Patent Issued to INTERNATIONAL BUSINESS MACHINES on Aug. 25 for "Semiconductor device with power supply distribution networks on frontside and backside of a circuit" (New York, New Hampshire, Vermont Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,148, issued on Aug. 25, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.). "Semiconductor device with power supply distr... और पढ़ें


US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Nonvolatile memory device and system comprising the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,149, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Nonvolatile memory device and system compris... और पढ़ें


US Patent Issued to NANYA TECHNOLOGY on Aug. 25 for "Semiconductor device with assisting layer and method for fabricating the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,150, issued on Aug. 25, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device with assisting layer and me... और पढ़ें


US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Semiconductor device having insulating layers with multiple material properties and method of fabricating same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,151, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device having insulating layer... और पढ़ें


US Patent Issued to NANYA TECHNOLOGY on Aug. 25 for "Semiconductor device and method for fabricating the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,152, issued on Aug. 25, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device and method for fabricating ... और पढ़ें


US Patent Issued to International Business Machines on Aug. 25 for "Topological semi-metal interconnects" (New York Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,153, issued on Aug. 25, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Topological semi-metal interconnects" was in... और पढ़ें


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 25 for "Semiconductor structure having verticle conductive graphene and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,154, issued on Aug. 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor structure having ... और पढ़ें


US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,155, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device" was invented by Jihyun... और पढ़ें


US Patent Issued to SG MICRO on Aug. 25 for "Device module, manufacturing method therefor, and inductor-capacitor array" (Chinese Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,156, issued on Aug. 25, was assigned to SG MICRO CORP (Beijing). "Device module, manufacturing method therefor, and inductor-capacitor arra... और पढ़ें


US Patent Issued to QUALCOMM Incorproated on Aug. 25 for "Die interconnect structure with embedded inductor(s) including coupled coils formed in redistribution layer (RDL) and adjacent bump-level distribution layer (BDL) for improved Q factor" (California Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,157, issued on Aug. 25, was assigned to QUALCOMM Incorproated (San Diego). "Die interconnect structure with embedded inductor(s) including ... और पढ़ें